Researchers

SHISHIDO Nobuyuki

SHISHIDO Nobuyuki
Associate Professor
Faculty Department of Mechanical Engineering / Graduate School of Science and Engineering
Researchmap https://researchmap.jp/7000010791

Education and Career

Academic & Professional Experience

  • Apr. 2024 , Kindai University Faculty of Science and Engineering Department of Mechanical Engineering 准教授
  • Apr. 2020 - Mar. 2024 , Kindai University Faculty of Science and Engineering Department of Mechanical Engineering 講師
  • Feb. 2016 - Mar. 2020 , Kyushu Institute of Technology Power Electronics 客員准教授
  • Oct. 2015 - Mar. 2020 , Green Electronics Research Institute, Kitakyushu PE信頼性研究室 Research Associate Professor
  • Oct. 2015 - Mar. 2017 , Nagoya Institute of Technology 大学院しくみ領域 産学官連携研究員
  • Apr. 2010 - Sep. 2015 , Nagoya Institute of Technology

Research Activities

Research Areas

  • Manufacturing technology (mechanical, electrical/electronic, chemical engineering), Machine materials and mechanics

Research Interests

電子実装, 信頼性設計, 破壊力学, 材料力学

Published Papers

  1. Application of Nonlinear Fracture Mechanics Parameter Δ T * to Estimating Wire-Liftoff Lifetime: Effect of Creep Constitutive Equations
    Nobuyuki Shishido; Yutaka Hayama; Saya Okamoto; Yusuke Shigyo; Shinya Taketomi; Masaaki Koganemaru; Seiya Hagihara; Noriyuki Miyazaki
    IEEE Transactions on Components, Packaging and Manufacturing Technology  , 1-1, 2026 
  2. Wire-Liftoff Lifetime Estimation Based on Thermal Fatigue Crack Growth: Proposal of Estimation Methodology Using Nonlinear Fracture Mechanics Parameter ΔT*
    Nobuyuki Shishido; Yuki Akinaga; Shohei Jitsuyama; Seiya Hagihara; Yutaka Hayama; Shinya Taketomi; Masaaki Koganemaru; Noriyuki Miyazaki
    Journal of The Japan Institute of Electronics Packaging  Nov. 2025 
  3. Effect of solder junction void variation in power semiconductor package on power cycle lifetime
    Hiroshi Onodera; Nobuyuki Shishido; Daisuke Asari; Hiroshi Isono; Wataru Saito
    Microelectronics Reliability  161  , 115471-115471, Oct. 2024 

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MISC

  1. パワー半導体パッケージにおけるはんだ接合ボイド変動がパワーサイクル寿命に及ぼす影響—Effect of Solder Junction Void Variation in Power Semiconductor Package on Power Cycle Lifetime—電子デバイス/半導体電力変換合同研究会・パワーデバイス・電力変換器とその制御 , 小野寺 浩; 浅利 太輔; 磯野 浩; 宍戸 信之; 齋藤 渉 , 電気学会研究会資料. SPC = The papers of technical meeting on semiconductor power converter, IEE Japan / 半導体電力変換研究会 [編] , 2024 , 178-194 , 47 , 52 , 14, Nov. 2024
  2. Mate2023 トクシュウゴウ : ダイ29カイ 「 エレクトロニクス ニ オケル マイクロ セツゴウ ・ ジッソウ ギジュツ 」 シンポジウム , 苅谷 健人; 宍戸 信之; 尾崎 仁哉; 浮田 昌也; 中原 健 , スマートプロセス学会誌 = Journal of smart processing , 12 , 5 , 251 , 256 , Sep. 2023
  3. チョッパ回路連続動作時におけるIGBTのV[CE(sat)]と温度プロファイルの測定—Experimental measurement of V[CE(sat)] and temperature profile in an IGBT during continuous chopper circuit operation—電力技術/電力系統技術/半導体電力変換 合同研究会 電力技術一般ならびに半導体電力変換一般 , 原 幹太; 長谷川 一徳; 宍戸 信之; 齋藤 渉; 二宮 保 , 電気学会研究会資料. PSE = The papers of Technical Meeting on "Power Systems Engineering", IEE Japan / 電力系統技術研究会 [編] , 2023 , 76-98 , 37 , 42 , 7, Mar. 2023

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Patents

  1. 金属配線構造及び金属配線形成方法 , 宍戸信之, 武富紳也 , 特許6912054
  2. 金属配線と絶縁層との密着強度の改善する方法 , 佐藤 尚, 宍戸 信之, 西田 政弘, 神谷 庄司
  3. 剪断剥離試験による界面強度の評価方法。 , 神谷 庄司, 宍戸 信之

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Awards & Honors

  1. Oct. 2025, IEC, 1906 Award
  2. Feb. 2017, スマートプロセス学会, Mate2017奨励賞
  3. Dec. 2016, 日本機械学会マイクロ・ナノ工学部門, 優秀講演論文賞

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Research Grants & Projects

  1. Japan Society for the Promotion of Science, Grants-in-Aid for Scientific Research, Development of evaluation and control method for local fluctuation of thermal characteristics near lattice defects , Saga University
  2. Japan Society for the Promotion of Science, Grants-in-Aid for Scientific Research, Detection of potential defects on small-scale interfacial structures , 北九州市環境エレクトロニクス研究所
  3. Japan Society for the Promotion of Science, Grants-in-Aid for Scientific Research Grant-in-Aid for Young Scientists (B), Qualitative evaluation for the diversity of interface strength due to fcc crystalline structure , Nagoya Institute of Technology

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