Researchers

SHISHIDO Nobuyuki

SHISHIDO Nobuyuki
Associate Professor
Faculty Department of Mechanical Engineering / Graduate School of Science and Engineering
Researchmap https://researchmap.jp/7000010791

Education and Career

Academic & Professional Experience

  • Apr. 2024 , Kindai University Faculty of Science and Engineering Department of Mechanical Engineering 准教授
  • Apr. 2020 - Mar. 2024 , Kindai University Faculty of Science and Engineering Department of Mechanical Engineering 講師
  • Feb. 2016 - Mar. 2020 , Kyushu Institute of Technology Power Electronics 客員准教授
  • Oct. 2015 - Mar. 2020 , Green Electronics Research Institute, Kitakyushu PE信頼性研究室 Research Associate Professor
  • Oct. 2015 - Mar. 2017 , Nagoya Institute of Technology 大学院しくみ領域 産学官連携研究員
  • Apr. 2010 - Sep. 2015 , Nagoya Institute of Technology

Research Activities

Research Areas

  • Manufacturing technology (mechanical, electrical/electronic, chemical engineering), Machine materials and mechanics

Research Interests

電子実装, 信頼性設計, 破壊力学, 材料力学

Published Papers

  1. Effect of solder junction void variation in power semiconductor package on power cycle lifetime
    Hiroshi Onodera; Nobuyuki Shishido; Daisuke Asari; Hiroshi Isono; Wataru Saito
    Microelectronics Reliability  161  , 115471-115471, Oct. 2024 
  2. Application of the Nonlinear Fracture Mechanics Parameter ΔT* to Wire-liftoff Lifetime Estimation of Power Modules at Elevated Temperatures
    Nobuyuki Shishido; Yutaka Hayama; Yuki Akinaga; shinya Taketomi; Masaaki Koganemaru; Seiya Hagihara; Noriyuki Miyazaki
    Journal of Electronic Packaging  , 1-23, 1, Aug. 2024 
  3. Power-cycling degradation monitoring of an IGBT module with VCE(sat) measurement in continuous operation of a chopper circuit
    Kazunori Hasegawa; Kanta Hara; Nobuyuki Shishido; Satoshi Nakano; Wataru Saito; Tamotsu Ninomiya
    Power Electronic Devices and Components  7  Apr. 2024 

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MISC

  1. Mate2023 トクシュウゴウ : ダイ29カイ 「 エレクトロニクス ニ オケル マイクロ セツゴウ ・ ジッソウ ギジュツ 」 シンポジウム , 苅谷 健人; 宍戸 信之; 尾崎 仁哉; 浮田 昌也; 中原 健 , スマートプロセス学会誌 = Journal of smart processing , 12 , 5 , 251 , 256 , Sep. 2023
  2. Discussion on the test methodologies for structural integrity of power module , Noriyuki Miyazaki; Masaaki Koganemaru; Nobuyuki Shishido; Tomoki Sakaguchi; Yutaka Hayama; Seiya Hagihara , Journal of Japan Institute of Electronics Packaging , 24 , 6 , 560 , 571 , 1, Sep. 2021
    Summary:Thermal fatigue of wire-bonding and die-attach materials is a critical factor in the structural integrity of power modules. A power-cycling test, a temperature-cycling test and a mechanical-fatigue test are utilized to evaluate the expected lifetime of power modules. Moreover, lifetime evaluation in the design phase is considered to be important for power modules incorporated into mass-produced commodities such as automobiles and home appliances, because in-service condition monitoring is difcult for power modules used in such commodities. In this paper, we consider a power-cycling test and a temperature-cycling test, and discuss the applicability of the lifetime evaluation formulae obtained from these tests to evaluating the lifetime of power modules in the design phase. In addition, we discuss a mechanical-fatigue test as a substitute for a temperature-cycling test. .
  3. Review of Methodologies for Structural Integrity Evaluation of Power Modules , Noriyuki Miyazaki; Nobuyuki Shishido; Yutaka Hayama , JOURNAL OF ELECTRONIC PACKAGING , 143 , 2 , Jun. 2021
    Summary:This paper reviews the previous research on the methodologies for evaluating structural integrity of wire bonds and die-attachments in power modules. Under power module operation, these parts are subjected to repeated temperature variations which induce repeated thermal stress due to the mismatch in coefficients of thermal expansion (CTE) of the constituent materials. Thus, thermal fatigue phenomena are critical issues for the structural integrity of power modules. In the present paper, we also deal with the evaluation methodologies for thermal fatigue in the temperatures over 200 degrees C, which are expected operational temperatures for wide bandgap semiconductor power modules. The failure models based on the temperature range Delta T widely used in the power electronics community are critically reviewed from a mechanical engineering viewpoint. Detailed discussion is given concerning the superiority of failure models based on the physical quantities such as the inelastic strain range Delta epsilon in, the inelastic strain energy density range Delta Win, and the nonlinear fracture mechanics parameter range Delta T* over the conventional Delta T-based failure models. It is also pointed out that the distributed state concept (DSC) approaches based on the unified constitutive modeling and the unified mechanics theory are promising for evaluating the structural integrity of power modules. Two kinds of test methods, a power cycling test (PCT) and a thermal cycling test (TCT), are discussed in the relation to evaluating the lifetimes of wire-liftoff and die attach cracking.

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Patents

  1. 金属配線構造及び金属配線形成方法 , 宍戸信之, 武富紳也 , 特許6912054
  2. 金属配線と絶縁層との密着強度の改善する方法 , 佐藤 尚, 宍戸 信之, 西田 政弘, 神谷 庄司
  3. 剪断剥離試験による界面強度の評価方法。 , 神谷 庄司, 宍戸 信之

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Awards & Honors

  1. Feb. 2017, スマートプロセス学会, Mate2017奨励賞
  2. Dec. 2016, 日本機械学会マイクロ・ナノ工学部門, 優秀講演論文賞
  3. Sep. 2009, エレクトロニクス実装学会, MES2008ベストペーパー賞

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Research Grants & Projects

  1. Japan Society for the Promotion of Science, Grants-in-Aid for Scientific Research, Development of evaluation and control method for local fluctuation of thermal characteristics near lattice defects , Saga University
  2. Japan Society for the Promotion of Science, Grants-in-Aid for Scientific Research, Detection of potential defects on small-scale interfacial structures , 北九州市環境エレクトロニクス研究所
  3. Japan Society for the Promotion of Science, Grants-in-Aid for Scientific Research Grant-in-Aid for Young Scientists (B), Qualitative evaluation for the diversity of interface strength due to fcc crystalline structure , Nagoya Institute of Technology

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