Researchers

FUJITA Takashi

FUJITA Takashi
Associate Professor
Faculty Department of Mechanical Engineering / Graduate School of Science and Engineering
Researchmap https://researchmap.jp/kikai-t.fujita

Education and Career

Academic & Professional Experience

  • Apr. 2020 - Today , Kindai University Faculty of Science and Engineering
  • Nov. 2001 - Mar. 2020 , Tokyo Seimitsu Co., Ltd.
  • Apr. 1991 - Oct. 2001 , Sumitomo Metal Industries, Co., Ltd.

Research Activities

Research Areas

  • Manufacturing technology (mechanical, electrical/electronic, chemical engineering), Manufacturing and production engineering
  • Manufacturing technology (mechanical, electrical/electronic, chemical engineering), Manufacturing and production engineering
  • Manufacturing technology (mechanical, electrical/electronic, chemical engineering), Electronic devices and equipment

Research Interests

Semiconductor substrate cutting, Pad conditioning, micro-grooving, Chemical-Mechanical Planarization

Published Papers

  1. Fine Grooving of Low-k Film Using Poly-Crystalline Diamond Blade
    Takashi Fujita; Yasuo Izumi; Junji Watanabe; Haruto Konishi
    Materials transactions  67  (4)  23, Jan. 2026  , Refereed
  2. Stable Pad Conditioning Using Bundled Flexible Fibers in Chemical Mechanical Planarization
    Takashi Fujita; Yutaro Arai; Michio Uneda
    ECS Journal of Solid State Science and Technology  15  , 014006-, 12, Jan. 2026  , Refereed
  3. Ultra-fine grooving technology for 4H-SiC substrate using poly-crystalline diamond (PCD) blade
    Haruto Konishi; Takashi Fujita; Yasuo Izumi; Junji Watanabe
    Journal of Advanced Mechanical Design, Systems, and Manufacturing  20  (1)  , No.25-00280-, Jan. 2026  , Refereed

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Books etc

  1. Ultra-precise and microfabrication process technology for silicon and compound semiconductors - Fundamentals and latest trends in process-specific machining technology - , Chapter 27 , Chapter 27 , CMC Publishing , Jun. 2024
  2. Latest trends in advanced semiconductor manufacturing processes and miniaturization technology , Chapter 7 Section 4 , Chapter 7 Section 4 , Technical Information Association Co., Ltd. , Sep. 2023
  3. Development trends in CMP technology that supports semiconductor device manufacturing , Chapter 3 Section 2 , Chapter 3 Section 2 , Science & Technology Co., Ltd. , 30, Aug. 2023

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Conference Activities & Talks

  1. Evaluation of surface roughness and residual stress on SiC substrate , Ryuu Furukawa; Takashi Fujita; Souta Matsuno; Junji Nagahashi; Ryota Yamazaki , 2025年度砥粒加工学会学術講演会論文集(2025)315-316 , 4, Sep. 2025
  2. Research on Constant Pressure Mirror Finishing Technology of SiC Substrates with PCD High Density Cutting Edge , Jun NISHIYAMA; Takashi FUJITA; Haruto KONISHI; Yuki IZUTANI; Yasuo IZUMI; Junji WATANABE , 2025年度砥粒加工学会学術講演会論文集 (2025)311-314 , 4, Sep. 2025
  3. Evaluation of surface roughness and processed modification layer in CMP process of GaN substrate , Sota MATSUNO; Ryota YAMAZAKI; Takashi FUJITA; Junji NAGAHASHI , 2025年度砥粒加工学会学術講演会論文集(2025)307-310 , 4, Sep. 2025

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MISC

  1. Laboratory Introduction Kindai University Advanced Processing Systems Engineering Laboratory , Takashi Fujita , 砥粒加工学会誌 , 68 , 8 , 450 , 450 , Aug. 2024
  2. "Visualization" of Polishing Pad Surface Properties by Flexible Fiber Conditioner and Its Mechanism Consideration , Michio Uneda; Takashi Fujita; Yutaro Arai , Journal of the Japan Society for Abrasive Technology , 67 , 2 , 71 , 74 , Feb. 2023
  3. 革新的な微細精密加工技術の開発を目指して , 藤田 隆 , 精密工学会誌 , 88 , 887 , 566 , 567 , Jul. 2022

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Patents

  1. 亀裂進展方法 , 押田修平, 清水 翼, 藤田 隆, 植木原明
  2. Crack propagation device and crack propagation method , Shuhei Oshida, Tasuku Shimizu, Takashi Fujita, Akira Uekihara , 特許7617357
  3. Crack propagation device and crack propagation method , 清水 翼, 押田修平, 植木原 明, 藤田 隆 , 特許7617359

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Awards & Honors

  1. Nov. 2024, Japan Society for Precision Engineering Autumn Meeting, Best Presentation Award
  2. Jun. 2024, Machine Tool Technology Promotion Foundation, Machine Tool Technology Promotion Award/Encouragement Award
  3. May. 2024, Mazak Foundation, Advanced Manufacturing Systems Outstanding Paper Award

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Research Grants & Projects

  1. 工作機械における新しい加工液塗布供給システムの開発
  2. Ministry of Economy, Trade and Industry Kinki Bureau of Economy, Trade and Industry, FY2020 R&D support project for growing small and medium-sized enterprises (Go-Tech project), Research and development of CMP pad grinding technology using a brush-type grinding plate to strengthen the supply chain for the revival of semiconductors , Kindai University
  3. Public Interest Incorporated Foundation Amada Foundation, General research and development grant, Development of ultrafine dicing processing technology by short pulse laser dressing for PCD blade , Kindai University

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