Researchers

FUJITA Takashi

Faculty	Department of Mechanical Engineering / Graduate School of Science and Engineering
Researchmap	https://researchmap.jp/kikai-t.fujita

Manufacturing technology (mechanical, electrical/electronic, chemical engineering), Manufacturing and production engineering
Manufacturing technology (mechanical, electrical/electronic, chemical engineering), Manufacturing and production engineering
Manufacturing technology (mechanical, electrical/electronic, chemical engineering), Electronic devices and equipment

Semiconductor substrate cutting, Pad conditioning, micro-grooving, Chemical-Mechanical Planarization

Polishing Mechanism Based on Morphological and Chemical Quantification of Pad Surface in Chemical Mechanical Planarization
Takuro Ito; Takashi Fujita; Kaito Yonemoto; Yuki Arai; Hiroyuki Hiyama; Yutaka Wada; Hozumi Yasuda; Ryota Koshino
International Conference on Planarization Technology , O17-001-O17-008, 31, Oct. 2023 , Refereed
Mirror-finishing technology for SiC substrates using PCD tools with high-density cutting edges
Haruto Konishi; Takashi Fujita; Ryota Fukunaga; Yasuo Izumi; Junji Watanabe
International Conference on Planarization Technology , P62-001-P62-004, 31, Oct. 2023 , Refereed
Study of fine groove machining using PCD (Poly-Crystalline Diamond) blade tool
Haruto KONISHI; Takashi FUJITA; Yasuo IZUMI; Kouji WATANABE; Daisuke YANAGIDA; Hisashi MINAMI; Junji WATANABE
Proceedings of 19th International Conference on Precision Engineering (C055) 1, Dec. 2022 , Refereed

Latest trends in advanced semiconductor manufacturing processes and miniaturization technology , Chapter 7 Section 4 , Chapter 7 Section 4 , Technical Information Association Co., Ltd. , Sep. 2023
Development trends in CMP technology that supports semiconductor device manufacturing , Chapter 3 Section 2 , Chapter 3 Section 2 , Science & Technology Co., Ltd. , 30, Aug. 2023
最新 CMP技術と周辺部材 , 湯之上隆 , 第6章第1節 , 第6章第1節 , 技術情報協会 , Feb. 2008

Fine mirror finishing technology using sintered diamond grinding tools , Takashi Fujita , Abrasive Processing Society Kansai Region Subcommittee 1st Research Meeting in 2024 , 22, Mar. 2024
CMP process technology and the latest processing technology for next-generation substrates (SiC, hard glass) , Takashi Fujita , Information organization seminar , 21, Mar. 2024
Quantitative evaluation of contact area on surface condition of polishing pad for semiconductor CMP , Kaito Yonemoto; Takashi Fujita; Takuro Ito; Hirokuni Hiyama; Yutaka Wada; Hozumi Yasuda; Ryota Koshino , Japan Society of Mechanical Engineers Kansai Branch 99th Ordinary General Meeting Lecture , 15, Mar. 2024

"Visualization" of Polishing Pad Surface Properties by Flexible Fiber Conditioner and Its Mechanism Consideration , Michio Uneda; Takashi Fujita; Yutaro Arai , Journal of the Japan Society for Abrasive Technology , 67 , 2 , 71 , 74 , Feb. 2023
革新的な微細精密加工技術の開発を目指して , 藤田隆 , 精密工学会誌 , 88 , 887 , 566 , 567 , Jul. 2022
Development of flexible fiber conditioner stabilizing CMP , Takashi FUJITA , 月間トライボロジー , 411 , 41 , 45 , Nov. 2021

Crack propagation device and crack propagation method , Shuhei Oshida, Tasuku Shimizu, Takashi Fujita, Akira Uekihara
Crack propagation device and crack propagation method , Tasuku Shimizu, Shuhei Oshida, Akira Uekihara, Takashi Fujita
Crack growth device and crack growth method , Shuhei Oshida, Tasuku Shimizu, Takashi Fujita, Akira Uekihara , 特許7290843

Jun. 2020, Machine Tool Technology Promotion Foundation, Technical Paper Award
Mar. 2020, The Japan Society for Precision Engineering, Numata memorial paper award
Oct. 2019, 発明協会, Invention Incentive Award

Ministry of Economy, Trade and Industry Kinki Bureau of Economy, Trade and Industry, FY2020 R&D support project for growing small and medium-sized enterprises (Go-Tech project), Research and development of CMP pad grinding technology using a brush-type grinding plate to strengthen the supply chain for the revival of semiconductors , Kindai University
Public Interest Incorporated Foundation Amada Foundation, General research and development grant, Development of ultrafine dicing processing technology by short pulse laser dressing for PCD blade , Kindai University
公益財団法人大澤科学技術振興財団, 一般研究開発助成, Development of ultra-fine cutting technology for SiC substrates using ultra-thin PCD blades , Kindai University