Researchers

FUJITA Takashi

FUJITA Takashi
Associate Professor
Faculty Department of Mechanical Engineering / Graduate School of Science and Engineering
Researchmap https://researchmap.jp/kikai-t.fujita

Education and Career

Academic & Professional Experience

  • Apr. 2020 - Today , Kindai University Faculty of Science and Engineering
  • Nov. 2001 - Mar. 2020 , Tokyo Seimitsu Co., Ltd.
  • Apr. 1991 - Oct. 2001 , Sumitomo Metal Industries, Co., Ltd.

Research Activities

Research Areas

  • Manufacturing technology (mechanical, electrical/electronic, chemical engineering), Manufacturing and production engineering
  • Manufacturing technology (mechanical, electrical/electronic, chemical engineering), Manufacturing and production engineering
  • Manufacturing technology (mechanical, electrical/electronic, chemical engineering), Electronic devices and equipment

Research Interests

Semiconductor substrate cutting, Pad conditioning, micro-grooving, Chemical-Mechanical Planarization

Published Papers

  1. Study of technology for fine conditioning of pad surfaces with fiber conditioner in CMP
    Haruki Hashimoto; Takashi Fujita
    Proceedings of 20th International Conference on Precision Engineering  , OS11-17-, Oct. 2024  , Refereed
  2. Evaluation on fine cutting edges of PCD grinding tool and mirror finishing surface on SiC substrates
    Haruto Konishi; Takashi Fujita; Ryota Fukunaga; Yuki Izutani; Yasuo Izumi; Junji Watanabe
    Proceedings of 20th International Conference on Precision Engineering  , OS06-16-, Oct. 2024  , Refereed
  3. Mirror-finishing technology for SiC substrates using PCD tools with high-density cutting edges
    Haruto Konishi; Takashi Fujita; Ryota Fukunaga; Yasuo Izumi; Junji Watanabe
    International Conference on Planarization Technology  , P62-001-P62-004, 1, Nov. 2023  , Refereed

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Books etc

  1. Ultra-precise and microfabrication process technology for silicon and compound semiconductors - Fundamentals and latest trends in process-specific machining technology - , Chapter 27 , Chapter 27 , CMC Publishing , Jun. 2024
  2. Latest trends in advanced semiconductor manufacturing processes and miniaturization technology , Chapter 7 Section 4 , Chapter 7 Section 4 , Technical Information Association Co., Ltd. , Sep. 2023
  3. Development trends in CMP technology that supports semiconductor device manufacturing , Chapter 3 Section 2 , Chapter 3 Section 2 , Science & Technology Co., Ltd. , 30, Aug. 2023

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Conference Activities & Talks

  1. Research on high-precision micromachining technology for difficult-to-cut materials using PCD blade tools , 福永涼太; 藤田 隆; 小西遥大; 和泉康夫; 渡邉純二 , 日本機械学会第15回生産加工･工作機械部門講演会 , 5, Oct. 2024
  2. Study on surface conditioning technology of CMP polishing pads using fiber conditioner , 橋本治樹; 藤田 隆 , Japan Society of Mechanical Engineers 2024 Annual Conference J132p-10 , 10, Sep. 2024
  3. SiC基板のPCDブレードによる送水加工技術 , 泉谷悠綺; 藤田 隆 , 日本機械学会2024年度年次大会 J132p-09 , 10, Sep. 2024

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MISC

  1. Laboratory Introduction Kindai University Advanced Processing Systems Engineering Laboratory , Takashi Fujita , 砥粒加工学会誌 , 68 , 8 , 450 , 450 , Aug. 2024
  2. "Visualization" of Polishing Pad Surface Properties by Flexible Fiber Conditioner and Its Mechanism Consideration , Michio Uneda; Takashi Fujita; Yutaro Arai , Journal of the Japan Society for Abrasive Technology , 67 , 2 , 71 , 74 , Feb. 2023
  3. 革新的な微細精密加工技術の開発を目指して , 藤田 隆 , 精密工学会誌 , 88 , 887 , 566 , 567 , Jul. 2022

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Patents

  1. Crack propagation device and crack propagation method , Shuhei Oshida, Tasuku Shimizu, Takashi Fujita, Akira Uekihara
  2. Crack propagation device and crack propagation method , Tasuku Shimizu, Shuhei Oshida, Akira Uekihara, Takashi Fujita
  3. Crack growth device and crack growth method , Shuhei Oshida, Tasuku Shimizu, Takashi Fujita, Akira Uekihara , 特許7290843

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Awards & Honors

  1. Nov. 2024, Japan Society for Precision Engineering Autumn Meeting, Best Presentation Award
  2. Jun. 2024, Machine Tool Technology Promotion Foundation, Machine Tool Technology Promotion Award/Encouragement Award
  3. May. 2024, Mazak Foundation, Advanced Manufacturing Systems Outstanding Paper Award

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Research Grants & Projects

  1. Ministry of Economy, Trade and Industry Kinki Bureau of Economy, Trade and Industry, FY2020 R&D support project for growing small and medium-sized enterprises (Go-Tech project), Research and development of CMP pad grinding technology using a brush-type grinding plate to strengthen the supply chain for the revival of semiconductors , Kindai University
  2. Public Interest Incorporated Foundation Amada Foundation, General research and development grant, Development of ultrafine dicing processing technology by short pulse laser dressing for PCD blade , Kindai University
  3. 大澤科学技術振興財団, 大澤科学技術振興財団研究助成, Development of mirror-finish grinding technology for SiC substrate surface using PCD micro-cutting edge tool , Kindai University

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