Researchers
- FUJITA Takashi
- Associate Professor
| Faculty | Department of Mechanical Engineering / Graduate School of Science and Engineering |
|---|---|
| Researchmap | https://researchmap.jp/kikai-t.fujita |
Education and Career
Academic & Professional Experience
- Apr. 2020 - Today , Kindai University Faculty of Science and Engineering
- Nov. 2001 - Mar. 2020 , Tokyo Seimitsu Co., Ltd.
- Apr. 1991 - Oct. 2001 , Sumitomo Metal Industries, Co., Ltd.
Research Activities
Research Areas
- Manufacturing technology (mechanical, electrical/electronic, chemical engineering), Manufacturing and production engineering
- Manufacturing technology (mechanical, electrical/electronic, chemical engineering), Manufacturing and production engineering
- Manufacturing technology (mechanical, electrical/electronic, chemical engineering), Electronic devices and equipment
Research Interests
Semiconductor substrate cutting, Pad conditioning, micro-grooving, Chemical-Mechanical Planarization
Published Papers
-
Precise Control of Wafer Edge Removal Profile in Chemical Mechanical Polishing
Takashi Fujita
ECS Journal of Solid State Science and Technology 15 , 074001-, 26, Jun. 2026 , Refereed -
Fine Grooving of Low-k Film Using Poly-Crystalline Diamond Blade
Takashi Fujita; Yasuo Izumi; Junji Watanabe; Haruto Konishi
Materials transactions 67 (4) 23, Jan. 2026 , Refereed -
Stable Pad Conditioning Using Bundled Flexible Fibers in Chemical Mechanical Planarization
Takashi Fujita; Yutaro Arai; Michio Uneda
ECS Journal of Solid State Science and Technology 15 , 014006-, 12, Jan. 2026 , Refereed
Books etc
- Ultra-precise and microfabrication process technology for silicon and compound semiconductors - Fundamentals and latest trends in process-specific machining technology - , Chapter 27 , CMC Publishing , Jun. 2024
- Latest trends in advanced semiconductor manufacturing processes and miniaturization technology , Chapter 7 Section 4 , Technical Information Association Co., Ltd. , Sep. 2023
- Development trends in CMP technology that supports semiconductor device manufacturing , Chapter 3 Section 2 , Science & Technology Co., Ltd. , 30, Aug. 2023
Conference Activities & Talks
- Micro-mirror surface machining technology using PCD grinding wheels , Takashi Fujita , The 128th Research Meeting of the Next-Generation Fixed Abrasive Machining Process Expert Committee of the Japan Society for Abrasive Technology , 21, Aug. 2026
- Precision machining technology for next-generation semiconductor materials , Takashi Fujita , The 452nd Seminar Organized by the Japan Society for Precision Engineering: "Precision Machining Technology for Semiconductor Materials" , 27, Jul. 2026
- Research on surface-based microconditioning technology for pads using fiber conditioners , Takumi Tomofuji; Takashi Fujita , Proceedings of the 2026 Kansai Regional Regular Academic Conference of the Japan Society for Precision Engineering (2026) , 19, Jun. 2026
MISC
- Laboratory Introduction Kindai University Advanced Processing Systems Engineering Laboratory , Takashi Fujita , 砥粒加工学会誌 , 68 , 8 , 450 , 450 , Aug. 2024
- "Visualization" of Polishing Pad Surface Properties by Flexible Fiber Conditioner and Its Mechanism Consideration , Michio Uneda; Takashi Fujita; Yutaro Arai , Journal of the Japan Society for Abrasive Technology , 67 , 2 , 71 , 74 , Feb. 2023
- 革新的な微細精密加工技術の開発を目指して , 藤田 隆 , 精密工学会誌 , 88 , 887 , 566 , 567 , Jul. 2022
Patents
- Crack propagation device and crack propagation method , Tasuku Shimizu, Shuhei Oshida, Akira Uekihara, Takashi Fujita
- 亀裂進展方法 , 押田修平, 清水 翼, 藤田 隆, 植木原明 , 特許7898502
- Crack propagation device and crack propagation method , Shuhei Oshida, Tasuku Shimizu, Takashi Fujita, Akira Uekihara , 特許7617357
Awards & Honors
- Nov. 2024, Japan Society for Precision Engineering Autumn Meeting, Best Presentation Award
- Jun. 2024, Machine Tool Technology Promotion Foundation, Machine Tool Technology Promotion Award/Encouragement Award
- May. 2024, Mazak Foundation, Advanced Manufacturing Systems Outstanding Paper Award
Research Grants & Projects
- Kinki Bureau of Economy, Trade and Industry, Ministry of Economy, Trade and Industry, FY2020 growth-type small and medium-sized enterprises, etc. research and development support project (GoTech project), Research and development of a bending stress concentration cleavage system to achieve high-quality individual wafer fragmentation of high-hardness wafers for next-generation power semiconductors. , Shin Nippon Tech Co., Ltd., Kindai University
- 工作機械における新しい加工液塗布供給システムの開発
- Ministry of Economy, Trade and Industry Kinki Bureau of Economy, Trade and Industry, FY2020 R&D support project for growing small and medium-sized enterprises (Go-Tech project), Research and development of CMP pad grinding technology using a brush-type grinding plate to strengthen the supply chain for the revival of semiconductors , Kindai University